Julin Technology Invited to Attend ICCAD Conference and Deliver Keynote Speech

In recent years, with the rapid development of the integrated circuit (IC) industry, the importance of EDA (Electronic Design Automation) — one of the core technologies supporting the industry — has become increasingly prominent. The ICCADExpo 2024 (Shanghai Integrated Circuit Annual Industry Development Forum and China IC Design Industry Exhibition) was held grandly at the Shanghai World Expo from December 11 to December 12.  Under the theme “Smart Shanghai, Empowering the World with Chips”, the conference delved deeply into the opportunities and challenges faced by the IC industry, particularly in IC design. The goal was to enhance innovation capabilities, strengthen the comprehensive capacity of China's IC industry chain, meet market demands, and improve international competitiveness.  

Highlights of the Conference  

As a leading industrial software enterprise in China, Julin Technology was invited by the organizers to showcase its latest research achievements and technologies at the conference. Through a keynote speech, exhibition booth displays, and technical exchanges, Julin Technology demonstrated its cuttingedge expertise in the industrial software field. The company also engaged in indepth discussions with numerous users, partners, and industry experts, exploring the future development of EDA technology.  

Julin Technology's showcased EDA solutions covered multiple stages, including circuit design, highspeed signal integrity, and batch postsimulation. Especially in chiplevel and systemlevel design simulation, Julin demonstrated its industryleading technological advantages. By participating in this event, Julin not only showcased its innovative technologies and product strengths but also further deepened its collaboration with upstream and downstream players in the IC industry chain, laying a solid foundation for future technological and market expansion.  

The core products and technological advantages

1、Signal integrity simulation platform: SIDesigner covers all functions of high-speed signal integrity simulation for similar foreign products, supports design optimization simulation, fast batch simulation, optimized schematic design, industry-leading product accuracy, and can improve engineer efficiency by 10+times in some scenarios, accelerating product launch and iteration. Tool improvement communication and response speed are extremely fast.

2、Power electronic system design and simulation platform: PowerExpert has rich modeling methods, supports multiple simulation types and device types, and has extremely high usability. Engineers can easily build power systems through PowerExpert for comprehensive system performance evaluation, optimize system reliability and stability, and accelerate product development and iteration processes. At present, PowerExpert has been fully validated by top clients in multiple industries in terms of accuracy, performance, model compatibility, modeling flexibility, stability, and usability.

3、Low speed signal batch simulation platform: HobbSim is a board level signal integrity batch simulation tool that can extract the topology structure of the board diagram through equivalent transmission lines, set chip pin models, and use SPICE simulation engine to simulate the characteristics of PCB networks. Multiple network topologies can also be extracted to the SIDesigner tool for editing and simulation, and the simulation results have been recognized by clients such as ZTE and VIVO. The post simulation function provided by HobbSim can perform table operations and is less prone to errors; Free your hands and set up backend operation all at once; Parallel simulation significantly reduces time and labor costs.

Technology Insight and Sharing

During the conference, Julin Technology founder and chairman, Mr.Jiaxin Sun, delivered a keynote speech titled “JULIN EDA: Silicon & PCB Proven Accuracy Simulate a Better Future” at the “EDA and IC Design Services Forum.”In his speech, Mr. Sun detailed Julin Technology’s exploration and practices in the EDA field, emphasizing the company’s core advantages in Silicon and PCB simulation.  

Mr. Sun pointed out that as the complexity of IC design continues to grow, traditional EDA tools are facing performance bottlenecks. Julin Technology, through its independently developed Julin EDA toolchain, is providing the industry with more efficient and precise solutions. He stressed that Julin Technology is committed to its mission of “Accurate Simulation, Empowering the Future”, offering users fullprocess support from chips to packaging to systems. This helps customers shorten R&D cycles, reduce design costs, improve product competitiveness, and achieve predictable success.  

During the speech, Mr. Sun also shared several realworld case studies, showcasing Julin EDA's exceptional performance in chip and PCB simulations. His presentation received high praise from the audience. After the speech, many attendees actively engaged with the Julin team to discuss technical details and explore collaboration opportunities.  

The Julin booth is full of warm atmosphere

The Julin Technology booth became a major attraction at the conference. With a sleek and modern design, the booth showcased the Julin EDA toolchain, its latest technological achievements, and successful application cases, drawing a large number of visitors.  

At the booth, Julin's technical staff enthusiastically explained product features and technological advantages to attendees, engaging in indepth discussions about cuttingedge applications and solutions to industry challenges. Through live demonstrations, visitors experienced firsthand the powerful performance of Julin EDA tools in critical areas such as silicon verification and PCB simulation.  Particularly in ultrahighspeed signal integrity simulation, highprecision circuit simulation, and ultrafast batch postsimulation, Julin’s solutions stood out for their exceptional compatibility and computational efficiency, earning widespread recognition.  

The booth also highlighted a series of successful case studies, which became focal points of discussion. For example, Julin showcased how a leading domestic client significantly shortened their R&D cycle and optimized their design process using Julin EDA tools. Comparisons of simulation times between Julin's products and foreign competitors sparked great interest among attendees. Many expressed that Julin's technological breakthroughs offered new ideas and directions for the chip and PCB design industries.  

To further engage attendees, Julin organized interactive prize draws, inviting visitors to participate in product experiences and Q&A sessions. These interactions not only brought Julin closer to potential customers but also provided deeper insights into the company’s technological strengths. Julin also distributed thoughtful gifts, including automatic umbrellas, Cornell grid notebooks, Pilot dualtip stylus pens, Year of the Snakethemed calendars, and 3in1 data cables. Many industry insiders expressed their hope to collaborate further with Julin in the future.  

Through this conference, Julin Technology established connections with numerous industry experts, partners,potential customers, creating more opportunities for future technological collaboration and market expansion. At the same time, Julin demonstrated its deep understanding of industry trends and forwardlooking strategic planning, further solidifying its market position as a leader in industrial software innovation.  

The appearance at the ICCAD conference is just one milestone in Julin Technology’s journey. Looking ahead, the company will continue to use innovation as its driving force and technology as its bridge, working together with the entire industry to embrace new challenges and create new opportunities.