​JULIN Technology at Chip Eco Technology Summit 2024, Empowering Automotive Chip Design

With the rapid development of the global new energy automotive industry, intelligent and internet-connected automotive technology has become the core driving force for industry change, and automotive chips, as the ‘heart’ of intelligent vehicles, play a crucial role in this process. In recent years, the technological innovation and market demand for automotive chips have grown dramatically, from autonomous driving to intelligent cockpit, from in-vehicle network to new energy three power systems, the application of chips is becoming more and more extensive and complex.

Against this background, the ‘2024 Automotive and New Energy Chip Eco Conference and the 4th Yangtze River Delta Automotive Chip Matchmaking Conference’ was successfully held on 12-13 November at Ruili Hotel in Shanghai Automotive City, which attracted industry experts, business leaders and technicians from home and abroad to discuss the current situation and future of the automotive chip industry. The summit attracted industry experts, business leaders and technicians from home and abroad to discuss the current situation and future of the automotive chip industry. The conference focused on the construction and design of chip platforms, the technical needs of in-vehicle chips in autonomous driving and new energy applications, chip security and testing, packaging processes and third-generation semiconductor materials and other hot topics for in-depth discussion. During the conference, guests shared the latest technical achievements and industry insights through keynote speeches, round-table forums and technology demonstrations, promoting innovative cooperation and technology integration in the field of automotive chips.

Highlights of the conference

As a leading industrial software company in China, JULIN was invited by the organisers to attend the conference, displaying the latest technology products and delivering important speeches.

Julin demonstrated its newly developed ‘High Precision EDA Universal Circuit Simulation Platform’ in the conference, which attracted a lot of attention. The platform integrates a number of advanced technologies in signal integrity simulation, power electronic system design and low-speed signal batch simulation, helping engineers to efficiently identify and solve potential problems at the early stage of circuit design, achieve design optimisation, and improve product performance and reliability.

The core products and technological advantages

1、Signal integrity simulation platform: SIDesigner covers all functions of high-speed signal integrity simulation for similar foreign products, supports design optimization simulation, fast batch simulation, optimized schematic design, industry-leading product accuracy, and can improve engineer efficiency by 10+times in some scenarios, accelerating product launch and iteration. Tool improvement communication and response speed are extremely fast.

2、Power electronic system design and simulation platform: PowerExpert has rich modeling methods, supports multiple simulation types and device types, and has extremely high usability. Engineers can easily build power systems through PowerExpert for comprehensive system performance evaluation, optimize system reliability and stability, and accelerate product development and iteration processes. At present, PowerExpert has been fully validated by top clients in multiple industries in terms of accuracy, performance, model compatibility, modeling flexibility, stability, and usability.

3、Low speed signal batch simulation platform: HobbSim is a board level signal integrity batch simulation tool that can extract the topology structure of the board diagram through equivalent transmission lines, set chip pin models, and use SPICE simulation engine to simulate the characteristics of PCB networks. Multiple network topologies can also be extracted to the SIDesigner tool for editing and simulation, and the simulation results have been recognized by clients such as ZTE and VIVO. The post simulation function provided by HobbSim can perform table operations and is less prone to errors; Free your hands and set up backend operation all at once; Parallel simulation significantly reduces time and labor costs.

Technology Insight and Sharing

In the Packaging & Test Technology session, Mr Yanfu Wu Senior Technical Engineer of JLT, delivered a wonderful speech entitled ‘Challenges and Solutions of Advanced Packaging’. Combined with the latest development trend of automotive chip packaging technology, Mr Wu deeply analysed the challenges in the field of advanced packaging, and shared the innovative ideas and solutions of Julin Technology in dealing with these challenges.

Wu pointed out that with the increasing integration of automotive chips, traditional packaging technology has been difficult to meet the demand for high performance and high reliability. Advanced packaging technologies, such as 2.5D/3D packaging and system-in-package (SiP), have become the key to improving chip performance and integration. However, advanced packaging technologies also bring many challenges, such as higher design complexity, stricter process control requirements, and higher costs.

In response to these challenges, Mr Wu gave a detailed introduction of JLT's technological advantages in advanced packaging design, simulation and verification. He emphasised that JilinTech's EDA platform can provide comprehensive package design and simulation support to help engineers perform adequate verification at the early stage of design, thereby reducing design risk and improving design efficiency. In addition, JLT has established close partnerships with several industry-leading vendors and is able to provide customers with customised packaging solutions.

Mr Wu's presentation was insightful and highly appreciated by the attendees. The views and experiences he shared not only provided valuable technical references for industry insiders, but also further enhanced the visibility and influence of Julin Technologies in the advanced packaging field.

JULIN's booth was full of excitement

In addition to the exciting product demonstrations and technical presentations, Julin Technology also set up a booth that attracted many attendees to stop and participate. Julin's technical experts patiently and carefully answered every visitor's questions and provided professional advice and solutions according to customer needs, fully demonstrating the company's technical strength and brand image to the audience.

Through the interactive exchanges at the booth, Julin Technology established contact with many potential customers, laying a good foundation for future market expansion. At the same time, Julin Technology also took the opportunity to understand the needs and pain points of customers, providing valuable reference for future product development and technological innovation.

All in all, Julin's wonderful performance at the ‘2024 Automotive and New Energy Chip Ecology Conference and the 4th Yangtze River Delta Automotive Chip Matchmaking Conference’ fully demonstrated its leading position and innovative strength in China's industrial software field. In the future, JULIN will continue to plough into the field of automotive chip design and simulation, and continue to introduce more advanced and efficient EDA simulation solutions to contribute to the sustainable development of China's automotive chip industry.

Through this conference, Julin Technologies not only demonstrated its latest technical achievements, but also further deepened its communication and cooperation with industry experts and partners. Driven by the wave of automotive intelligence and electrification, JULIN will continue to give full play to its technological advantages, contribute to the innovative development of the automotive chip industry, and work together with its partners to create a better future for the automotive chip industry.