Julin Technology Attended the first “SEMiBAY” and delivered several important speeches

Recently, Julin Technology participated in the first “SEMiBAY”, an exhibition focusing on the latest developments in the semiconductor industry that brought together many industry leaders and professionals. The exhibition was rich and diverse, covering cutting-edge areas such as chip design, packaging technology, AI applications, etc. It provided an ideal platform for exhibitors to showcase new products and release new technologies. Meanwhile, the establishment of several professional forums also creates a valuable opportunity for industry experts and enterprise representatives to share and exchange the latest technologies and successful experiences.

Highlights of the conference 

As a leader in the industry, Julin Technologies made a great splash at this year's SEMiBAY, not only delivering a number of noteworthy keynote speeches, but also showing the audience its latest technological crystallization -"High precision EDA General Circuit Simulation Platform" . In addition, Julin also introduced in detail a number of core technologies, their wide range of applications and significant advantages in the semiconductor industry.

The core products and technological advantages

1、Signal integrity simulation platform: SIDesigner covers all functions of high-speed signal integrity simulation for similar foreign products, supports design optimization simulation, fast batch simulation, optimized schematic design, industry-leading product accuracy, and can improve engineer efficiency by 10+times in some scenarios, accelerating product launch and iteration. Tool improvement communication and response speed are extremely fast.

2、Power electronic system design and simulation platform: PowerExpert has rich modeling methods, supports multiple simulation types and device types, and has extremely high usability. Engineers can easily build power systems through PowerExpert for comprehensive system performance evaluation, optimize system reliability and stability, and accelerate product development and iteration processes. At present, PowerExpert has been fully validated by top clients in multiple industries in terms of accuracy, performance, model compatibility, modeling flexibility, stability, and usability.

3、Low speed signal batch simulation platform: HobbSim is a board level signal integrity batch simulation tool that can extract the topology structure of the board diagram through equivalent transmission lines, set chip pin models, and use SPICE simulation engine to simulate the characteristics of PCB networks. Multiple network topologies can also be extracted to the SIDesigner tool for editing and simulation, and the simulation results have been recognized by clients such as ZTE and VIVO. The post simulation function provided by HobbSim can perform table operations and is less prone to errors; Free your hands and set up backend operation all at once; Parallel simulation significantly reduces time and labor costs.

Technology Insight and Sharing

1、In the “AI Chip and HPC Application Forum”, Mr. Beijie Qian, Director of R&D Department of Julin Technology, delivered a keynote speech titled “SIDesigner Optimize your AI & HPC Design ”, which brought a refreshing technological perspective to the attendees.

Mr. Qian explained the key role of signal integrity simulation in AI and HPC chip design, pointed out the main pain points currently faced, and vividly demonstrated how to effectively solve these problems by combining with JULIN Technology's self-developed solutions. He emphasized that high-precision and high-speed signal integrity simulation is the cornerstone of guaranteeing chip performance and stability, and JULIN has deep technical accumulation and rich practical experience in this regard.

Mr. Qian was confident in the rapid development of emerging technologies such as 5G and 6G. He also believes that these technologies will further amplify the importance of signal integrity, and JULIN will, as always, increase R&D investment, keep up with the industry's most cutting-edge simulation needs, and continue to provide customers with higher precision, higher speed, and more stable signal integrity solutions, to help customers make greater breakthroughs in the field of AI and HPC.

2、In the “Chiplet and Advanced Packaging Technology Forum” held at the same time, Mr. Yanfu Wu, Senior Product Engineer of JULIN Technology, also delivered a keynote speech entitled “Challenges and Solutions for Advanced Package”, sharing with the participants JULIN's technological breakthroughs and response strategies in the field of advanced packaging.

Mr. Wu pointed out that with the continuous iteration and upgrading of chip packaging technology, its complexity and difficulty are also increasing, which puts forward higher requirements for simulation technology. He analyzed in detail the main challenges faced in the current chip packaging design, and combined with the high-precision and high-speed signal integrity simulation case of JULIN Technology, demonstrated its unique coping strategies and technical advantages.

Mr. Wu emphasized that in the face of an increasingly competitive environment, win-win cooperation within the industry is crucial. JULIN is looking forward to working with more like-minded partners to meet the challenges brought by future chip packaging technology, seize the opportunities given by the times, and create a new chapter for the prosperous development of the industry.

The Julin booth is full of warm atmosphere

JULIN's booth became a highlight of the exhibition, attracting a large number of visitors to stop and exchange ideas. In addition to a wealth of technical displays and product demonstrations, Julin's technical team conducted in-depth interactive discussions with engineers from all walks of life to jointly study current technical problems and future cooperation space. This not only highlights Julin's leadership in technological innovation and market response, but also injects new vitality and thinking into the development of the entire industry.

At the SEMIBAY, JULIN showcases its latest achievements in EDA and actively seeks opportunities for future cooperation. As the semiconductor industry continues to evolve, JLT expects to find a better balance between technological innovation and market demand, and continue to provide customers with excellent solutions to help them achieve predictable success.

In the face of the rapid development of the global semiconductor industry, Julin Technology will unswervingly walk at the forefront of innovation, maintain the spirit of criticism and self-criticism, and continuously pursue excellence. The company aspires to achieve greater breakthroughs in the core areas of AI chip design, high-performance computing, and advanced packaging technologies, to make greater contributions to the prosperity of the semiconductor industry, and to strive to become a highly respected leading industrial software company in China.